JPH041504B2 - - Google Patents

Info

Publication number
JPH041504B2
JPH041504B2 JP61117255A JP11725586A JPH041504B2 JP H041504 B2 JPH041504 B2 JP H041504B2 JP 61117255 A JP61117255 A JP 61117255A JP 11725586 A JP11725586 A JP 11725586A JP H041504 B2 JPH041504 B2 JP H041504B2
Authority
JP
Japan
Prior art keywords
lead
tab
free end
leads
dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61117255A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61258462A (ja
Inventor
Keizo Ootsuki
Kazuo Shimizu
Fumihito Inoe
Susumu Okikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP61117255A priority Critical patent/JPS61258462A/ja
Publication of JPS61258462A publication Critical patent/JPS61258462A/ja
Publication of JPH041504B2 publication Critical patent/JPH041504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61117255A 1986-05-23 1986-05-23 電子部品の組立方法 Granted JPS61258462A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61117255A JPS61258462A (ja) 1986-05-23 1986-05-23 電子部品の組立方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61117255A JPS61258462A (ja) 1986-05-23 1986-05-23 電子部品の組立方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1146179A Division JPS55103789A (en) 1979-02-05 1979-02-05 Strucutre for mounting electronic part

Publications (2)

Publication Number Publication Date
JPS61258462A JPS61258462A (ja) 1986-11-15
JPH041504B2 true JPH041504B2 (en]) 1992-01-13

Family

ID=14707235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61117255A Granted JPS61258462A (ja) 1986-05-23 1986-05-23 電子部品の組立方法

Country Status (1)

Country Link
JP (1) JPS61258462A (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5671897A (en) * 1979-11-13 1981-06-15 Sanyo Electric Co Ltd Nonvolatile storage device
JPS58215794A (ja) * 1982-06-08 1983-12-15 Toshiba Corp 不揮発性メモリ装置
JPS59135600U (ja) * 1983-02-25 1984-09-10 株式会社アドバンテスト 書き換え可能な不揮発性メモリを有する電子機器

Also Published As

Publication number Publication date
JPS61258462A (ja) 1986-11-15

Similar Documents

Publication Publication Date Title
US6410979B2 (en) Ball-grid-array semiconductor device with protruding terminals
US7405104B2 (en) Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
JP3165078B2 (ja) 表面実装部品の製造方法
JP2000156433A (ja) 電子装置
JPH07273268A (ja) 半導体パッケージ及び半導体パッケージ用リードフレーム
JPH08264842A (ja) 側面発光装置
JPH02239651A (ja) 半導体装置およびその実装方法
JPH041501B2 (en])
JP4600124B2 (ja) 半導体パッケージの製造方法
JP2001035961A (ja) 半導体装置及びその製造方法
JPS63296252A (ja) 樹脂封止型半導体装置
JP2000349222A (ja) リードフレーム及び半導体パッケージ
JPS63232342A (ja) 半導体装置
JPH041504B2 (en])
KR910000018B1 (ko) 리이드프레임을 갖춘 반도체장치 및 그 제조방법
JPH01102947A (ja) 樹脂封止型半導体デバイスおよびリードフレーム
US5343615A (en) Semiconductor device and a process for making same having improved leads
JPH0516724Y2 (en])
JPS62263665A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPH05166964A (ja) 半導体装置
KR940008291Y1 (ko) 플라스틱 반도체 패키지
JPS61258460A (ja) 電子部品用リードフレーム
JPS63160262A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPH033354A (ja) 半導体装置
JPS61258496A (ja) 電子部品の実装方法